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SilicorAI Inc

Patented Architecture-to-Gate Optimization

SilicorAI delivers AI-driven semiconductor optimization for advanced SoC designs—improving power, performance, area (PPA), and time-to-market through intelligent datapath architectures, low-power BLIB libraries, and the ARCEL AI-EDA optimization platform.

We combine deep semiconductor engineering with AI to accelerate full silicon lifecycle—from RTL and synthesis to floor planning, P&R, and post-silicon validation.

  • Up to 15–30% power reduction

  • Works on 65nm → 7nm (Bulk / FD-SOI / FinFET)

  • Zero Verification Overhead

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ENTERPRISE VALIDATION

Zero Verification Overhead

Seamlessly integrate into large, rigid design flows without disrupting your verification cycles

No RTL Changes

Zero modifications to your RTL codebase. Works with your existing design as-is.

No Verification Effort

Eliminates the bottleneck of additional verification cycles. Your validation team stays on schedule.

Seamless Integration

Plug-and-play integration into existing EDA flows. No workflow disruption.

Enterprise validation teams save weeks of verification cycles.

SilicorAI's architecture-to-gate optimization delivers PPA improvements without requiring any changes to your RTL or verification testbenches—addressing one of the biggest bottlenecks in large-scale chip design.

OUR MISSION

Architecture-to-Gate PPA Optimization
for Advanced SoCs

SilicorAI improves power, performance, and area (PPA) for SoC designs through optimized datapath architectures, low-power BLIB libraries, and the ARCEL AI-EDA platform, delivering measurable silicon-level uplift without RTL or verification changes.

AI-driven selection

Plug and Play Product

Faster turnaround time

Zero verification overhead

Scales for advanced nodes

Works with any foundry or EDA ecosystem

Validated Across Industry Leaders

SilicorAI's patented architecture-to-gate optimization has been deployed and validated by leading semiconductor companies across diverse domains and architectures.

High-Performance FPGAs

Deployed on compute-intensive FPGA blocks for data center and networking applications.

RISC-V CPUs

Validated on RISC-V CPU cores and datapath logic for embedded and edge computing.

Automotive MCUs

Evaluated for automotive microcontrollers and SoCs requiring ultra-low power.

AI Accelerators & NPUs

Optimized MAC arrays, matrix engines, and systolic arrays for AI workloads.

Wireless & Modem SoCs

Deployed on wireless baseband datapaths and modem processing units.

Networking ASICs

Validated on packet processing datapaths and switch fabric architectures.

17 customer engagements across the United States, Japan, APAC, and India—including leading FPGA vendors, RISC-V CPU developers, automotive semiconductor companies, and wireless SoC manufacturers.

What We Offer

Complete technology stack: Low-power datapath architectures, BLIB cell libraries, ARCEL AI-EDA platform, and optimized datapath IP for compute-intensive workloads.

SilicorAI

Pioneering the future of semiconductor technology.

Cross-node support:65nm → 7nm
Works with standard EDA toolchains

BLIB: Low-Power Cell Libraries

Advanced leakage-aware standard cell library that reduces switching, leakage, and area. Results: Dynamic Power ↓ 12–67%, Leakage Power ↓ 20–163%, Area ↓ 10–15%. BLIB is NOT a replacement for foundry libraries; it is a workload-optimized companion library focused on datapath-driven power savings.

ARCEL: AI-EDA

Agentic AI system that dynamically adjusts PPA optimization decisions across RTL → gate → PnR → sign-off flow. 15–30% power reduction, 20–40% faster TAT.

Datapath IP Portfolio

Optimized adders, multipliers, MACs, and DSP blocks engineered for low switching, tight timing, and compact area. Delivers 15–30% power reduction and 10–20% area savings across datapath-intensive workloads.

Prototype & Pilot Fabrication

End-to-end support from architecture through silicon bring-up, with strategic partnerships worldwide.

Where We Shine

Peak benefits at 16nm/14nm/12nm/7nm where leakage + dynamic imbalance is greatest.

AI accelerators & NPUs

DSP-heavy blocks

RISC-V CPU internal datapaths

Graphics/Compute arrays

Wireless + modem datapaths

Networking switch/packet datapaths

Industries We Empower

Transforming diverse sectors with cutting-edge semiconductor technology.

Edge AI & IoT

Edge AI & IoT

Smart devices and connected systems

Consumer Electronics

Consumer Electronics

Mobile and wearable technology

AI Datacenters

AI Datacenters

Hyper Scale Data center

Research Institutions

Research Institutions

Academic and research innovation

Defense & Aerospace

Defense & Aerospace

Mission-critical applications

Why Partner with SilicorAI?

Only Vendor Optimizing PPA from Architecture Through Gate-Level: Addressing Power, Performance, and Area (PPA) from the architecture level to gate level, not just within individual EDA stages.

Zero RTL Changes → Zero Verification Overhead: Our products are non-intrusive and integrate seamlessly into existing flows, requiring no additional RTL edits or verification effort.

Demonstrated Improvements at 65/40/28/16/14/12/7nm: Proven across multiple nodes, with higher gains at advanced nodes (16nm, 14nm, 12nm, 7nm) where leakage and dynamic power are hardest to optimize.

Up to 15–30% Power Reduction and 10–15% Area Improvement: Typical evaluation results vary by design, node, and workload.

Works Across Major Tools: Compatible with Synopsys (DC, Fusion Compiler, PT), Cadence (Genus, Innovus, Tempus), and Siemens (Aprisa).

Protected by Granted U.S. Patent Portfolio: Validated intellectual property protecting our core innovations.

Proven Across 17 Customers Worldwide: Tested & validated across US, Japan, APAC, and India with consistent PPA improvements.

Works with All Architectures: CPUs, GPUs, NPUs, AI accelerators, DSPs, wireless, networking, and RISC-V architectures.

Future-Proof: Patented architecture-driven model scales its PPA benefits deeper into advanced nodes (7nm, 5nm, and below).

Global Customer Footprint

SilicorAI collaborates with customers across the United States, Japan, APAC, and India—with 17 total engagements spanning POCs, evaluations, and joint optimization projects.


4 regions 17 Ongoing customer engagements

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United States

Total Engagements

7

Key Activities

POCs, Optimization, and Co-Validation for high-performance FPGA, RISC-V CPU, DSP, and specialized Optical/Analytics silicon.

Japan

Total Engagements

2

Key Activities

Evaluations focused on Consumer and Automotive MCU/SoC suitability.

APAC

Total Engagements

4

Key Activities

Combination of POCs and Evaluations targeting CPU/DSP IP and large-scale ASIC/HPC architectures.

India

Total Engagements

4

Key Activities

POCs, Joint Technical Work, and Evaluations across Wireless, EDA, and Telecom ASIC design domains.

Trusted by Global Semiconductor Innovators

Engineers across the United States, Japan, APAC, and India rely on SilicorAI to deliver realistic, architecture-level PPA gains—without disrupting RTL or verification flows.

United States · ARCEL AI-EDA Platform

POC — High-Performance FPGA Compute Block

Director of Silicon Architecture, U.S. FPGA Company

"ARCEL helped us uncover architecture choices that our tools were not exploring. We saw meaningful reductions in switching activity on a compute-critical block, and the integration had zero disruption on our RTL or verification. For a two-week POC, the insight was extremely valuable."

Testimonials are anonymized and NDA-safe; roles and regions are representative of real customer engagements.

Ready to Optimize Your Silicon Design?

With SilicorAI's patented PPA technologies, achieve significant power reduction, performance uplift, and area savings across edge, cloud, and mission-critical applications. Let's build the future of intelligent chips—together.